(a
subsidiary of United Pacific Industries Limited - HKSE:176)
STAMPING
Using different profile punches the final profile or the configuration of the
lead-frame is progressively punched out. The stamping process is ideal for
product with long life cycle and of certain production volume. The stamped
lead-frame thickness ranges from 0.1mm to 0.635mm.
Products type:
CHEMICAL
MILLING (ETCHING)
Chemical Milling or Etching was developed to provide a shorter turn around time
for products to reach the market. The entire lead-frame profile (cut length) is
subjected to etching process simultaneously. Advantages of etch process
includes, shorter time to market, lower tooling cost and ability to produce
prototype before actual production. Please click here to view pictures of
products >
PLATING
Several metals are deposited on the lead-frame during the plating process.
Metals include Nickel, Copper, Gold, Silver and Palladium. Basic configuration
of plating includes Spot, Ring, Selective and Full plating. Various combination
of metal deposition is available. Various form of plating process such as
plating in both strip and reel form is also available. Special coating for
specific purpose is also performed in the plating process. Please click here to view pictures of
products >
TAPING
AND CUT-DOWNSET
Certain lead-frame requires taping especially those with long and thin leads,
to ensure lead location during the wire bonding process. Various combination of
down-set is available such as deep down-set (thermal enhancement), fused leads
design. Progressive downset process and modular tool design. Please click here to view pictures of
products >
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